Kugwiritsa ntchito mu Semiconductor Viwanda
GREEN ndi National High-Tech Enterprise yodzipereka ku R&D ndikupanga zida zamagetsi zamagetsi zamagetsi ndi zida zoyesera za semiconductor & kuyesa. Kutumikira atsogoleri amakampani monga BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, ndi mabizinesi ena 20+ a Fortune Global 500. Wokondedwa wanu wodalirika pamayankho apamwamba opanga.
Makina omangira amathandizira kulumikizana kwapang'ono ndi ma diameter a waya, kuonetsetsa kukhulupirika kwa chizindikiro; formic acid vacuum soldering imapanga zolumikizana zodalirika pansi pa okosijeni <10ppm, kuteteza kulephera kwa okosijeni muzosunga zolimba kwambiri; AOI imalepheretsa zolakwika za micron-level. Synergy iyi imatsimikizira> 99.95% zokolola zapamwamba zonyamula, kukwaniritsa zofunikira zoyesa za tchipisi ta 5G/AI.
Akupanga Waya Bonder
Wotha kumangirira waya wa aluminiyamu 100 μm–500 μm, waya wamkuwa 200 μm–500 μm, nthiti za aluminiyamu m’lifupi mpaka 2000 μm m’lifupi ndi 300 μm wandiweyani, komanso nsinga zamkuwa.
Maulendo: 300 mm × 300 mm, 300 mm × 800 mm (customizable), ndi kubwereza <±3 μm
Maulendo oyenda: 100 mm × 100 mm, ndi kubwereza <±3 μm
Kodi Wire Bonding Technology ndi chiyani?
Kumangirira waya ndi njira yolumikizira ma microelectronic yomwe imagwiritsidwa ntchito kulumikiza zida za semiconductor kumapaketi awo kapena magawo ake. Monga imodzi mwaukadaulo wofunikira kwambiri pamsika wa semiconductor, imathandizira kulumikizana kwa chip ndi mabwalo akunja pazida zamagetsi.
Zida Zolumikizira Waya
1. Aluminiyamu (Al)
Kuwongolera kwapamwamba kwamagetsi motsutsana ndi golide, zotsika mtengo
2. Mkuwa (Cu)
25% yapamwamba yamagetsi / matenthedwe kuposa Au
3. Golide (Au)
Mulingo woyenera kwambiri wa conductivity, kukana dzimbiri, komanso kudalirika kolumikizana
4. Siliva (Ag)
Kuthamanga kwambiri pakati pazitsulo
Aluminium Waya
Aluminium Riboni
Waya Wamkuwa
Riboni ya Copper
Semiconductor Die Bonding & Wire Bonding AOI
Imagwiritsa ntchito kamera yamafakitale ya 25-megapixel kuti izindikire zolakwika zomangika ndi waya pazinthu monga ma IC, IGBTs, MOSFETs, ndi mafelemu otsogolera, kukwaniritsa chiwongola dzanja choposa 99.9%.
Milandu Yoyendera
Wokhoza kuyang'ana kutalika kwa chip ndi flatness, chip offset, kupendekera, ndi kupukuta; solder mpira sanali adhesion ndi solder olowa detachment; Kuwonongeka kwa mawaya kuphatikiza kutalika kapena kusakwanira kwa loop, kugwa kwa loop, mawaya oduka, mawaya osowa, kulumikizana ndi mawaya, kupindika mawaya, kuwoloka, ndi kutalika kwa mchira; zomatira zosakwanira; ndi metal splatter.
Mpira wa Solder / Zotsalira
Chip Scratch
Kuyika kwa Chip, Dimension, Tilt Meas
Chip Kuipitsidwa/Zinthu Zakunja
Chip Chipping
Ceramic Ngalande ming'alu
Kuwonongeka kwa Ceramic Trench
AMB Oxidation
In-Line Formic Acid Reflow Oven
1. Kutentha kwakukulu ≥ 450 ° C, vacuum level osachepera <5 Pa
2. Imathandizira mapangidwe a formic acid ndi nitrogen process
3. Mlingo wopanda kanthu wa mfundo imodzi ≦ 1%, mulingo wonse wopanda kanthu ≦ 2%
4. Kuziziritsa kwamadzi + kuziziritsa kwa nayitrogeni, kokhala ndi makina oziziritsa madzi komanso kuziziritsa kukhudzana
IGBT Power Semiconductor
Kuchulukirachulukira pakusokonekera mu IGBT soldering kumatha kuyambitsa kulephera kwamaketani kuphatikiza kuthawa kwamafuta, kuwonongeka kwamakina, komanso kuwonongeka kwamagetsi. Kuchepetsa kuchuluka kwa zinthu zopanda kanthu kufika pa ≤1% kumawonjezera kudalirika kwa chipangizo komanso kugwiritsa ntchito mphamvu.
IGBT Production process flow chart
