Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01
Product Mbali
● Phatikizani mawaya wandiweyani ndi zingwe mu nsanja imodzi yamakina ndikusintha mwachangu dongosolo;
● Kudzera pa patent kuwotcherera ndondomeko ulamuliro, ndi kuwotcherera magawo akhoza kusinthidwa mu nthawi yeniyeni zinthu zosinthika pamwamba kuonetsetsa repeatable kuwotcherera khalidwe;
●Yendetsani kuwonekera mwa kuphatikizika kosasinthika malinga ndi malamulo a Viwanda 4.0/OT;
● Kupeza zinthu zabwino kwambiri zofananira kudzera mumitundu yosiyanasiyana ya akupanga zomwe mungasankhe, ndikulimbikitsa kukhazikika kwa njirayi;
● Kuphatikizika kwa teknoloji ya ndondomeko ndi makina opangidwa kuchokera ku gwero limodzi loperekera.
Lembani uthenga wanu apa ndikutumiza kwa ife