Wire Bonding Machine
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Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01
Kwa mabatire atsopano amphamvu, ma inverters a photovoltaic, zamagetsi zamagalimoto, zosungirako mphamvu, IGBT, BMS batire zowongolera chitetezo cha batire, etc.
Makina omangira mawayawa amatha kukhala ogwirizana ndi aluminiyamu ndi waya wamkuwa;
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Makina Omangira Aluminiyamu Opangira Mawaya a TO Series Wire Bonding -Wedge Bonding ICs/GR-W02
A Single-row TO mndandanda wapadera wamawaya omangira makina;
GR-W02 ndi makina opangira mawaya oyenera zida zamagetsi, mankhwalawa amagwirizana ndi mzere umodzi mpaka mizere yambiri yopanga ma ultrasonic ma CD ndi kapangidwe kake, bonder imagwiritsidwa ntchito pakachulukidwe kambiri kobwerezabwereza, pogwiritsa ntchito makina okhazikika komanso odalirika, koyilo ya mawu. motors, akupanga machitidwe opanga. Kuphatikiza apo, kuthekera kozindikirika kowonjezereka kwa chipangizochi kumapereka zopanga zotsogola zamakampani komanso kudalirika.
