Wire Bonding Machine
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Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01
Kwa mabatire atsopano amphamvu, ma inverters a photovoltaic, zamagetsi zamagalimoto, zosungirako mphamvu, IGBT, BMS batire zowongolera chitetezo cha batire, etc.
Makina omangira mawayawa amatha kukhala ogwirizana ndi aluminiyamu ndi waya wamkuwa;
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Makina Omangira Aluminiyamu Opangira Mawaya a TO Series Wire Bonding -Wedge Bonding ICs/GR-W02
A Single-row TO mndandanda wapadera wamawaya omangira makina;
GR-W02 ndi makina opangira mawaya oyenera zida zamagetsi, mankhwalawa amagwirizana ndi mzere umodzi mpaka ma multi-row akupanga ma CD ndi kapangidwe kake, bonder imagwiritsidwa ntchito pambuyo pa kukweza kwambiri kopitilira muyeso, pogwiritsa ntchito makina okhazikika komanso odalirika, ma coil motors, makina akupanga akupanga. Kuphatikiza apo, kuthekera kozindikirika kowonjezereka kwa chipangizochi kumapereka zopanga zotsogola zamakampani komanso kudalirika.
